Process Expert -Power Module in Automotive semiconductor industry(m/f/d)

Bitte bewerben Sie sich hier auf „MINTsax.de“ mit dem „Bewerben“ Link/Button rechts oben.

Hinweis: Bitte bewerben Sie sich ausschließlich über unseren direkten Bewerbungslink gehostet von Empfehlungsbund und MINTsax.de: https://www.mintsax.de/jobs/270368/process-expert-power-module-in-automotive-semiconductor-industry-m-slash-f-slash-d. Wir freuen uns darauf, Sie kennenzulernen!

Company Profile: 

Our customer is R&D Center in Munich, which belongs to a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide safer, more comfortable, and more convenient products and services.

Duties and responsibilities:

• Tracking SiC power module technology trends, defining power module process technology roadmap;
• Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes;
• Leading team to develop advanced power module processes, output process files;
• Support product development team to finish product development and import to factory for mass production;
• Support mass production process teams to solve major process issues, improve reliability and yield.

Requirements:

Education/Experience

• Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields;
• More than 8 years of experience in power semiconductor packaging product development or technology research and development;
• Experience in industry-leading product development and mass production is preferred;
• Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect;
• Have successful experience in SiC module development, and those who develop products to achieve mass production status are preferred;

Knowledge

• Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry;
• Profound knowledge of key packaging processes & corresponding equipment, e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.

Skills and Competencies

• Proactive, with pioneering spirit and a good sense of internal and external client;
• Passionate about engineering, with a strong spirit of innovation;
• Good command of English written and oral communication skills，Chinese is a plus;

Our customer offers a competitive salary package and excellent career development opportunities in the promising new energy vehicle industry. If you are interested in this position, please feel free to send your resume to our talent manager Ms. Lan email Kontakt-Formular . We look forward to getting to know you better.